FCS Partners with Korea’s CKST as Exclusive Distributor for Glass Substrate Equipment, Advancing Dual-Track Semiconductor Strategy
FCS Precision Industry Co., Ltd. (FCS, TWSE: 6603) announced on the 14th its official expansion into the semiconductor industry. FCS has signed a strategic cooperation agreement with Korea-based China Korea Smart Technology (CKST), securing exclusive distribution rights for CKST equipment in Taiwan and Southeast Asia. The two companies will jointly develop opportunities in glass substrate equipment, a key enabling technology for next-generation AI chips and high-performance computing (HPC) advanced packaging, marking an important step in FCS's semiconductor growth strategy.
Combining Korean Core Technologies with Local Service to Capture Emerging Glass Substrate Opportunities
As demand for large language models and AI computing continues to accelerate, conventional organic substrates such as ABF face increasing challenges in warpage and thermal stress as package sizes grow. Glass substrates, featuring high rigidity, low warpage, and strong high-frequency electrical performance, are emerging as a promising next-generation solution, although mass production still presents technical challenges. According to SEMI forecasts cited by FCS, initial commercial mass production could begin as early as 2028, with the market projected to reach US$13 billion by 2040 and a compound annual growth rate (CAGR) of 67.2%.
FCS Chairman Po-Hsun Wang stated that CKST's core technologies originate from Korea's established semiconductor R&D ecosystem, with extensive expertise and practical experience in glass substrate TGV, VP, VCP, and advanced packaging equipment. FCS, meanwhile, brings more than five decades of experience in equipment manufacturing and system integration, supported by capabilities in precision manufacturing, automation integration, and global service. Through this collaboration, the two companies aim to combine their complementary strengths and provide customers across Asia with integrated equipment and localized support.
FCS will introduce the following equipment under the exclusive distribution agreement:
- Advanced VP Vertical Plating Equipment: Proprietary control technology maintains plating deviation within 3%.
- High-Speed VCP Vertical Continuous Plating Equipment: Designed for efficient, large-scale mass production.
- High-Performance SPP Panel-Level Plating Equipment: Covers TGV via filling through mass-production plating applications, providing a comprehensive equipment solution.
FCS CEO Alan Wang added that the company has been extending its long-established manufacturing strengths into advanced technology applications in recent years, and the cooperation with CKST represents another key step in expanding its semiconductor business. Beyond equipment distribution, FCS will leverage its capabilities in high-end equipment manufacturing, automation integration, and global after-sales service to provide localized technical support and integrated solutions for semiconductor customers. As advanced packaging capacity continues to expand across Asia, FCS expects demand for glass substrate equipment to accelerate between 2028 and 2030.
Dual-Track Semiconductor Strategy: Advanced Components and Packaging Equipment
Looking ahead, in addition to introducing advanced glass substrate packaging equipment, FCS is advancing a dual-track growth strategy across the semiconductor, ICT, and AI supply chains:
- Growth Engine A — Advanced MLPC Multilayer Solid Capacitors
To address demand from AI servers, GPU accelerator cards, and automotive electronics for high-power, high-voltage, and low-ESR components, FCS plans an initial investment of NT$200 million to establish an AI manufacturing base and advanced MLPC production line, targeting import-substitution opportunities in a market of approximately six billion units annually. - Growth Engine B — Exclusive Distribution of CKST Equipment
Through the distribution of TGV, VP, VCP, and other key electroplating systems for advanced semiconductor packaging, FCS aims to serve PCB, IC substrate, and semiconductor packaging and testing customers across Taiwan and Southeast Asia.
Three Key Machines at TaipeiPLAS 2026 Highlight Smart and Sustainable Manufacturing
While expanding into the semiconductor sector, FCS continues to strengthen its core injection molding business. At TaipeiPLAS 2026, held September 15–19 at Booth J0617, FCS presented its “Form to Future” theme, led by the SA-1000 Outward Toggle Injection Molding Machine with 1,000 tonf clamping force—the largest machine FCS has exhibited at TaipeiPLAS. The system demonstrates large-scale precision molding, high efficiency, and energy-saving capabilities for applications including new energy vehicles, semiconductors, and AI infrastructure.
The SA-160 focuses on AI-enabled smart molding, incorporating AI-based quality inspection as well as mold cooling-water flow and temperature sensing technologies. The CT-120 all-electric injection molding machine combines segmented energy-consumption monitoring with PCR recycled materials to demonstrate low-carbon molding. All three machines are connected through the iMF 4.0 Intelligent ManuFactory System, showcasing FCS's integrated capabilities spanning advanced equipment, AI-assisted molding, and low-carbon smart factories.
FCS Group recorded revenue of NT$5.08 billion in 2025, reaching a record high. Revenue for the first eight months of 2026 totaled NT$3.109 billion, up 1.44% year over year. Within its core injection molding business, demand from automotive component customers and AI/ICT-related industries continued to grow steadily, accounting for approximately 50% and 26% of revenue, respectively, during the period. Revenue from ICT and semiconductor-related applications increased by 5% year over year in the first eight months.
FCS continues to operate through five production bases in Taiwan, Dongguan, Ningbo Jiangbei, Ningbo Qianwan, and India. Its iMF 4.0 Intelligent ManuFactory System currently connects more than 1,000 machines worldwide, extending the company's business model from equipment sales toward Industrial SaaS subscription services and manufacturing digitalization.
FCS stated that the partnership represents more than an equipment distribution agreement; it also marks a further expansion into the semiconductor sector. Building on its core strengths in precision injection molding and smart manufacturing, FCS will integrate advanced semiconductor packaging equipment and high-end electronic components into its business portfolio, with the goal of increasing the contribution of AI, ICT, and semiconductor-related businesses while strengthening its position in global smart manufacturing and semiconductor supply chains.
About FCS
Founded in 1974, FCS Precision Industry Co., Ltd. (6603) specializes in intelligent plastic injection molding equipment. Its businesses cover smart injection molding production lines, automotive components, dedicated injection molding machines for semiconductor-related applications, and technologies for sustainable material processing. FCS solutions serve industries including automotive components, semiconductors and ICT, sporting goods, and infrastructure, with products supplied to more than 60 countries worldwide. The Group operates five production bases in Taiwan, Dongguan, Ningbo Jiangbei, Ningbo Qianwan, and India.
In recent years, FCS has continued to integrate cross-disciplinary technologies and leverage its five production bases for flexible manufacturing and global supply. Through its FCS AI Innovation Initiative, the company is expanding solutions in smart manufacturing, turnkey factory integration, and proactive preventive maintenance, further advancing its role as a provider of intelligent injection molding solutions.
