[Commercial Times] FCS Becomes Taiwan’s First Plastics Machinery Maker to Enter the MLPC Market
2026.08.14 / Commercial Times-Mei-Hsing Shen
FCS is partnering with a semiconductor packaging and diode technology team to establish a new company and begin producing MLPC multilayer solid-state capacitors at its Guanmiao plant in Tainan by the end of 2026. Target applications include AI servers, GPUs, CPUs, and high-end power modules. The move expands FCS from machinery manufacturing into high-end electronic components and creates a new growth engine.
FCS CEO Alan Wang said the Group will pursue a dual-track strategy of “core business advancement + new business growth.” (Photo courtesy of FCS)
FCS noted that growing AI computing demand is driving upgrades in GPU, CPU, and AI server power systems. High-end power modules increasingly require capacitors with high capacitance, low resistance, heat resistance, long life, and thinner designs. Global MLPC demand is estimated at 6–8 billion units annually. About 90% of the GPU capacitor market is supplied by Japanese manufacturers, prompting customers to seek alternative suppliers.
FCS will leverage its expertise in packaging equipment, precision manufacturing, and automation to enter the AI server and GPU power supply chain, focusing on MLPC capacitors with low stress, high capacitance, and thin-profile designs.
FCS is discussing a joint venture with a team with over 30 years of experience in packaging and diode technologies. The new company will have capital exceeding NT$200 million and plans to install three production lines at the Guanmiao plant. MLPC production is scheduled to begin by the end of 2026, with annual capacity expected to reach 250 million units by 2028 and over 600 million by 2030, followed by an IPO plan.
FCS will initially invest through new equipment and later provide additional capital. The Group aims to become the largest single shareholder and potentially include the new company in consolidated revenue. Its core business will continue expanding injection molding applications in automotive, AI, and ICT, while the new business moves into key AI components.
Source: [Commercial Times] https://www.ctee.com.tw/news/20260814700202-439901