SWOP 2015 Preview
FCS sincerely welcomes you to come and visit our booth at SWOP 2015.
Location：Shanghai New International Expo Centre (SNIEC)
Shanghai World of Packaging (SWOP) 2015 will take place on November 17-20, 2015 at Shanghai New International Expo Centre (SNIEC). It is comprised of four professional exhibitions, from the production of numerous items for packaging like materials (plastic, paper, glass, metal, etc.), printing and respective processing technologies (PackPro Asia), to packaging for pharmaceutical and cosmetic processing (CHINA-PHARM), food processing and packaging technology (FoodPex), and lastly bulk cargoes, external packaging and transportation solutions (BulkPex). SWOP offers a one-stop packaging and processing solution, as well as an interactive exchange platform for packaging and printing companies, end-product manufacturers and other buyers.
SWOP was organized by Messe Düsseldorf (Shanghai) Co., Ltd., China Centre for Food & Drug International Exchange (CC FDIE), Adsale Exhibition Services Ltd., providing buyers a one-stop platform for packaging and processing solutions. The four events, which has at least 1500 exhibiting companies, boasts an exhibition area of more than 60,000 sqm and is estimated to attract more than 60,000 industry buyers. This creates an ideal combination for 2015’s much awaited exhibition!
FCS is devoted to develop their turnkey projects in order to satisfy customers’ demand for a “one-stop-shopping” solution. In addition, FCS is also aware of the expansion in Mainland China’s food industry and its corresponding packaging industry in recent years. Therefore in 2007, FCS created a sophisticated automation system that integrates injection molding with labeling technology which was introduced as the A-PACK IML System. FCS has consistently displayed this system in international exhibitions in China (CHINAPLAS) as well as other exhibitions all over the world. And this year, FCS selects Shanghai World of Packaging (SWOP) to present their new application of the A-PACK IML System in the International Packaging Material Production and Processing Exhibition area (PacPro Asia).
The New A-PACK IML Solution consists of 4 components which includes a high-speed/close loop hybrid injection molding machine (AF-200), a 4-cavity hot-runner cup mold, a label feeding robot, and a product stacking system. The thin-walled cup produced at the event is expected to attract curious guests and visitors with its smooth and fast cycle time (approximately 5 secs). The AF series is equipped with an ESD screw and adopts a dual-loop system designed to make it cleaner, more efficient, and more precise. Moreover, its aesthetically sound appearance highlights the whole system’s suitability for the European market.
This new system not only displays an intricate packaging technique, but most importantly reflects the demand for energy saving technology in the market and the growing trend of the industry. Even when it was first exhibited during 2010’s TAIPEIPLAS, an order was placed immediately. It was a system that brought the house down in numerous international exhibitions and was even awarded as an honorable mention for the “Plastic Injection Molding Machine Innovation”. However, do not let your guard down by thinking that they have reached their limits as FCS has built an All New A-PACK IML Solution to steal the show.
Reference Source: SWOP Official Website
Contact: Mr. John Hsieh (Business Director)
Tel: +886 (06) 595 0688 Ext.6869
Exhibition Website Link→